Agnisio - a touch to Happiness
The AGNISIO Standard

Surgical Engineering for Mobile Tech

Founded with a commitment to right-to-repair integrity, AGNISIO combines advanced micro-soldering with transparent component teardowns.

Our Philosophy

We Fix What Authorized Outlets Call "Irreparable"

Major manufacturers often recommend whole-device replacements for minor component failures on the logic board. At AGNISIO, we believe every device deserves precise, surgical component-level diagnostics.

We isolate damaged PMICs, trace cracked copper vias, replace burnt capacitors, and preserve original user data without expensive board replacements.

100% Genuine OEM Parts & TrueTone Serial Sync
Zero Data Loss Policy with Encrypted Backups
6-Month Comprehensive Parts & Labor Warranty

Why Customers Trust AGNISIO

6-Month Unconditional Warranty

Every repair is logged into our digital warranty ledger with part serial numbers.

Same-Day Express Service

Over 85% of screen and battery replacements are completed in under 25 minutes.

Certified Micro-Soldering Specialists

Our service center experts hold IPC-7711/7721 Rework of Electronic Assemblies credentials.

Service Center Infrastructure

High-Precision Repair Infrastructure

Equipped with military-grade diagnostic tools and cleanroom standards for non-destructive chip recovery.

Cleanroom Micro-Environment

Ultra-pure laminar airflow isolation chambers that eliminate airborne dust particles during OLED display laminations and optical camera lens seals.

High-Definition Optical Stereo Optics

40x optical stereo magnification systems allowing micro-soldering precision for 0201 SMD resistors, 3nm SoC interconnects, and logic board traces.

Infrared Thermal Power-Leak Detection

High-sensitivity FLIR thermal scanners to pinpoint shorted ICs and microscopic current leaks down to 0.01 Amp power anomalies.

Precision Thermal-Profile Rework Stations

Microprocessor-controlled hot-air rework tools engineered for delicate BGA chip reballing while shielding sensitive board layers from thermal stress.